Filters
Standard Filter Products:
Q Microwave´s catalog parts are categorized by filter function (bandpass, lowpass, or highpass) to quickly get to what signal conditioning you are looking to achieve. If you are unable to find a filter meeting your requirements contact our sales team to inquire about a custom solution. Typical lead times for custom solutions can vary based on packaging and design difficulty. An initial prototype can take between 8-10 weeks and will be in one of our standard housings and may not meet your final packaging requirements, but will get you testing right away. A good rule of thumb for custom packaged solutions is 14-18 weeks.
Specialties:
- Integrated Filter Packaging - We specialize in integration-ready filters from the package design to impedance matching techniques.
- Hi-Rel Product Line - Q Microwave offers space-level filters with quality requirements and documentation tailored to demanding program requirements.
- High Frequency LC Filters - Available up to 18 GHz.
- Military-Grade Ceramic Filters - Design techniques used to withstand challenging military environments and lifetime requirements.
- Hermetic Combline Filters - When needed, we have the ability to hermetically seal our combline filters with a laser-welded cover.
- Multiplexing - Our design capabilities include high-performance contiguous or non-contiguous multiplexers with narrow or wide passbands.
- Hybrid-Ready Filters - We optimize the design and inputs for compatibility with microelectronic assemblies.
Catalog Filters
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Bandpass Filters
Our bandpass filters, both off-the-shelf and custom made, are created for a broad range of frequency spectrum applications such as broadband, space, o...
Highpass Filters
Our high-quality Highpass Filters are engineered to provide superior performance and unwavering reliability in the most challenging operational enviro...
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Lowpass Filters
Our RF Low-Pass Filters are meticulously engineered to meet stringent demands of modern applications, delivering superior performance and unwavering r...
Packaging
Q Microwave's design approach emphasizes the use of standard components. For our customers, this means standardized packaging and inputs are preferred in order to reduce cost and delivery time. Q Microwave's standard packaging includes the following configurations.
| Lumped Element | Ceramic Resonator | Cavity/ Combline | |
|---|---|---|---|
| Connectors | ✓ | ✓ | ✓ |
| SMT | ✓ | ✓ | ✓ |
| Leads | ✓ | ✓ | ✓ |
Surface Mount Configurations
Achieves the most popular solution based upon ease of installation and small size.
- Construction - The filter is built on a soft substrate and covered with an EMI shield. The input, output, and ground contacts are provided on the under side of the package. High temperature solder is used in its construction in order to improve yield during installation.
- Mounting - This packaging approach requires your substrate layout to accept the input/output pad configuration for the filter. These layout requirements can be provided in advance of your purchase. Installation is typically achieved with common Sn63 solder reflow processes. During installation, care must be taken to ensure that the filter's internal temperature is not permitted to exceed 220C. Recommended solder reflow profiles are available at our website.
- Applications - Typically used for applications below 6 GHz. Performance is heavily dependent upon the quality of the ground as determined by the circuit layout and attachment. Rejection performance is typically limited to 50 dBc.
Provides a surface mountable design while allowing the use larger metal packages that may be required for hermetic devices or filters with machined packages.
- Construction - The filter is typically built within a stainless steel, kovar, or brass housing with RF feedthrus at the input/output. The filter is EMI sealed and can be hermetically sealed if necessary.
- Mounting - Given the relative mass of the package, mounting is typically achieved through mechanical fasteners. The base of the housing provides ground and the input and output pins are pre-formed to make contact with your substrate's circuit.
Typically used to achieve higher performance transitions at higher frequencies. The microstrip geometry provides lower loss and improved isolation performance. The filter is typically built within a kovar housing and a non-hermetic EMI seal. The package should be epoxy attached or solder reflowed into your assembly. Interconnects must be made and optimized by the customer using either wire bonding or soldering processes.
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